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Biden signs bill to boost U.S. chips, compete with China
Published on: 2022-08-10
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US President Joe Biden on Tuesday signed a landmark bill to provide $52.7 billion in subsidies for U.S. semiconductor production and research and to boost efforts to make the United States more competitive with China's science and technology efforts.
 

"The future is going to be made in America," Biden said, calling the measure "a once-in-a-generation investment in America itself."
 

Biden touted investments that chip companies are making even though it remains unclear when the U.S. Commerce Department will write rules for reviewing grant awards and how long it will take to underwrite projects.
 

Some Republicans joined Biden on the White House lawn to attend the signing of the chips bill that was years in the making in Congress.
 

The White House said the bill's passage was spurring new chip investments. It noted that Qualcomm on Monday agreed to buy an additional $4.2 billion in semiconductor chips from GlobalFoundries' New York factory, bringing its total commitment to $7.4 billion in purchases through 2028.
 

The White House also touted Micron announcing a $40 billion investment in memory chip manufacturing, which would boost U.S. market share from 2% to 10%, an investment it said was planned with "anticipated grants" from the chips bill.
 

拜登签署芯片和科学法案,对美本土芯片产业提供巨额补贴

美国总统拜登9日在白宫签署《芯片和科学法案》。白宫当天发布声明称,该法案将为美国半导体研发、制造以及劳动力发展提供527亿美元。
 

二级市场上,美股三大指数集体收跌,英特尔、AMD等美股芯片股领跌。
 

据中新社8月10日消息,美国总统拜登9日在白宫签署《芯片和科学法案》。该法案对美本土芯片产业提供巨额补贴,并要求任何接受美方补贴的公司必须在美国本土制造芯片。

白宫当天发布声明称,该法案将为美国半导体研发、制造以及劳动力发展提供527亿美元。其中390亿美元将用于半导体制造业的激励措施,20亿美元用于汽车和国防系统使用的传统芯片。此外,在美国建立芯片工厂的企业将获得25%的减税。
 

拜登表示,这项法案将为美国整个半导体供应链提供资金,促进芯片产业用于研究和开发的关键投入。该法案要求任何接受美国政府资金的芯片企业必须在美国本土制造他们研发的技术。这意味着“在美国投资,在美国研发,在美国制造”。
 

除了对美国芯片产业以及制造业的直接支持,该法案规定多项措施加大对美国科学和工程领域的投入。根据该法案,美国国家科学基金会将建立一个技术、创新和伙伴关系理事会,专注于半导体和先进计算、先进通信技术、先进能源技术、量子信息技术和生物技术等领域的发展。同时,该法案还授权100亿美元用于投资美国各地的区域创新和技术中心,以加强地方政府、高校以及企业在技术创新和制造方面的合作。

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